產品介紹
Vacuum reflow technology
Traditional soldering often leaves tiny pores (voids) inside the solder joint due to flux vaporization or uneven heating. Vacuum reflow soldering can significantly solve the following problems:
- Void-Free: Significantly reduces the void ratio within solder joints (typically to below 1%~5%), improving electrical conductivity and structural strength.
- Improved Heat Dissipation: Reduced voids lower thermal resistance, crucial for heat dissipation of high-power components (such as IGBTs and high-power LEDs).
- Oxidation Prevention: Vacuum or nitrogen environments prevent metal surface oxidation at high temperatures, ensuring good solder wettability.
- High Reliability: Reduces the risk of solder joint breakage due to vibration or thermal cycling, widely used in automotive electronics, medical devices, and aerospace.
Applications
- Automotive Electronics
- Energy Management
- Telecommunications Infrastructure
- Defense Industry
Feature & Benefits
- PCB Layout Design
- Automotive-Grade SMT Manufacturing
- Near-Pin Engineering Prototype (NPI)
- Mass Production Services
